Current Position:
Software Engineer at HPExperience:
6 yearsLocation:
Irvine, California, United StatesSep 2024 - Current
Dec 2023 - Aug 2024
Jul 2023 - Jan 2024
Mar 2023 - Jun 2023
Feb 2023 - Jun 2023
Aug 2022 - Jun 2023
Sep 2021 - Jun 2023
Oct 2021 - Jun 2022
Mar 2021 - Sep 2021
Jan 2021 - Jun 2021
Oct 2020 - Mar 2021
Bachelor of Science - BS at UC Irvine
Taipei Wego Private Senior High School
What is Jared Lai's minimum period of employment in the companies?
Jared Lai's minimum period of employment in various companies is 3 months.What is Jared Lai's average duration of employment for different companies?
On average, Jared Lai works for one company for 8 monthsWhat industries has Jared Lai worked in?
Jared Lai works in the Information Technology and Services. Previously, Jared Lai worked in the Aviation & Aerospace, and Computer Hardware, and Higher Education.What positions has Jared Lai held before?
Previously, Jared Lai worked as a Embedded Software Engineer, MTS I, and IFE Tester, MTS I, and Software Firmware Engineer, and Student Researcher, and Embedded Engineer, Navigation Sub-Team.How do I contact Jared Lai?
Jared Lai's email address is j*******i@hp.com, phone number is +1-909-***-**94. Sign up to get contact details.Who is the President & CEO of the HP?
The President & CEO of the HP is Enrique LoresWho are Jared Lai's peers at other companies?
Jared Lai's peers at other companies are Bhoomi Zalavadiya and ankita agrawal and Gurvinder Singh AroraFind email for 850M+ professionals
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